Nanoscale CMOS VLSI Circuits: Design for Manufacturability
Published on 16. August 2010
Book
Hardback
316 pages
978-0-07-163519-6 (ISBN)
Description
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Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and lower power consumption. Costs, constraints, and computational efficiencies are also discussed in the practical resource.
Nanoscale CMOS VLSI Circuits covers:
Current trends in CMOS VLSI design
Semiconductor manufacturing technologies
Photolithography
Process and device variability: analyses and modeling
Manufacturing-Aware Physical Design Closure
Metrology, manufacturing defects, and defect extraction
Defect impact modeling and yield improvement techniques
Physical design and reliability
DFM tools and methodologies
Cutting-Edge CMOS VLSI Design for Manufacturability TechniquesThis detailed guide offers proven methods for optimizing circuit designs to increase the yield, reliability, and manufacturability of products and mitigate defects and failure. Covering the latest devices, technologies, and processes, Nanoscale CMOS VLSI Circuits: Design for Manufacturability focuses on delivering higher performance and lower power consumption. Costs, constraints, and computational efficiencies are also discussed in the practical resource.
Nanoscale CMOS VLSI Circuits covers:
Current trends in CMOS VLSI design
Semiconductor manufacturing technologies
Photolithography
Process and device variability: analyses and modeling
Manufacturing-Aware Physical Design Closure
Metrology, manufacturing defects, and defect extraction
Defect impact modeling and yield improvement techniques
Physical design and reliability
DFM tools and methodologies
More details
Language
English
Place of publication
United States
Publishing group
McGraw-Hill Education - Europe
Target group
College/higher education
Professional and scholarly
Product notice
Unsewn / adhesive bound
Paper over boards
Illustrations
0 Illustrations
Dimensions
Height: 231 mm
Width: 155 mm
Thickness: 25 mm
Weight
567 gr
ISBN-13
978-0-07-163519-6 (9780071635196)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Dr. Sandip Kundu is a professor in the Electrical and Computer Engineering Department at the University of Massachusetts at Amherst, specializing in semiconductor and lithographic manufacturing.
Dr. Aswin Sreedhar is a research assistant at the Electrical and Computer Engineering Department at the University of Massachusetts.
Dr. Aswin Sreedhar is a research assistant at the Electrical and Computer Engineering Department at the University of Massachusetts.
Content
Chapter 1. Introduction; Chapter 2. Semiconductor Manufacturing; Chapter 3. Process and Device Variability: Analysis and Modeling; Chapter 4. Manufacturing-Aware Physical Design Closure; Chapter 5. Metrology, Manufacturing Defects, and Defect Extraction; Chapter 6. Defect Impact Modeling and Yield Improvement Techniques; Chapter 7. Physical Design and Reliability; Chapter 8. Design for Manufacturability: Tools and Methodologies