RF and Microwave Microelectronics Packaging II
Description
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.