
Design and Analysis of Heat Sinks
Wiley (Publisher)
1st Edition
Published on 13. February 1996
Book
Hardback
424 pages
978-0-471-01755-4 (ISBN)
Description
A powerful methodology for producing superior thermal performanceat low cost with minimum added mass . . .
Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* Mathematical tools for heat-sink analysis and design
* Prevailing thermal transport processes
* Models for a variety of fin geometries
* Simple "transfer function" relations for single fin, cascadedfin, and fin array heat sinks
* Thermal characterization and optimization of plate-fin heatsinks
Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.
Here is the only available comprehensive treatment of the designand analysis of heat sinks. It provides all the theoretical andpractical information necessary to successfully design and/orselect cost-effective heat sinks for electronic equipment. Thepresentation includes detailed explanations of the governing heattransfer phenomena, complete coverage of thermal modeling tools forgeometrically complex fin structures, and extensive discussion onrecognizing thermal optimization opportunities.
Other topics covered include:
* Fundamentals of heat transfer
* Thermal modeling of electronic packages
* Mathematical tools for heat-sink analysis and design
* Prevailing thermal transport processes
* Models for a variety of fin geometries
* Simple "transfer function" relations for single fin, cascadedfin, and fin array heat sinks
* Thermal characterization and optimization of plate-fin heatsinks
Completely self-contained and filled with valuable information notavailable from any other single source, Design and Analysis of HeatSinks is both a superior reference for accomplished thermalspecialists and an excellent textbook for graduate courses inadvanced thermal applications for mechanical engineering students.This book can also serve as a text in thermal science for studentsof electrical engineering.
More details
Series
Language
English
Place of publication
United States
Publishing group
John Wiley & Sons Inc
Target group
College/higher education
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 235 mm
Width: 157 mm
Thickness: 29 mm
Weight
838 gr
ISBN-13
978-0-471-01755-4 (9780471017554)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates,a consulting firm in Pacific Grove, California. He is a formerfaculty member in the Electrical Engineering Department of theNaval Postgraduate School in Monterey, California.
AVRAM BAR-COHEN is Professor and Director of the Thermodynamics andHeat Transfer Division in the Mechanical Engineering Department ofthe University of Minnesota.
AVRAM BAR-COHEN is Professor and Director of the Thermodynamics andHeat Transfer Division in the Mechanical Engineering Department ofthe University of Minnesota.
Author
Allan D. Kraus Associates, Pacific Grove, CA
University of Minnesota, Minneapolis
Content
Linear Transformations.
Elements of the Linear Transformations.
Singular Fins and Spines and Single Elements.
Algorithms for Finned Array Assembly.
Examples of Finned Array Analysis.
Reciprocity and Node Analysis.
A General Array Method.
Convective Optimizations.
Heat Transfer-Parallel Plate Heat Sinks.
References.
Appendices.
Indexes.
Elements of the Linear Transformations.
Singular Fins and Spines and Single Elements.
Algorithms for Finned Array Assembly.
Examples of Finned Array Analysis.
Reciprocity and Node Analysis.
A General Array Method.
Convective Optimizations.
Heat Transfer-Parallel Plate Heat Sinks.
References.
Appendices.
Indexes.