
Polymer Interfaces and Thin Films: Volume 710
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
306 pages
978-1-107-41195-1 (ISBN)
Description
Polymer interfaces are critical for many technological and industrial applications in thin films including microelectronics, packaging, automotive coatings and sensors. The structure and architecture of interfaces in thin films and bulk polymeric systems can be exceedingly complex. In thin films, the technological drive to diminish film thickness while simultaneously enhancing homogeneity, stability and adhesion, is a demanding challenge driving research in newer areas of nanofilled and controlled nanostructured and nanopatterned materials. Tailoring surface and interfacial properties is equally important for new developments in the traditional fields of bulk polymer blends, adhesion and wetting. There is a need to develop an understanding of interfacial phenomena with the ultimate goal of establishing structure-property relationships with quantitative predictive capabilities and this book discusses these challenges. Topics include: block copolymer films; theory, simulations and dynamics; polymer interfaces and thin films; adhesion and mechanical properties; self-assembly by polymeric films; self-assembly and electronic properties; lithographic, electronic properties; and nanoparticulate-filled films.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 16 mm
Weight
410 gr
ISBN-13
978-1-107-41195-1 (9781107411951)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

Alamgir Karim | Thomas P. Russell | Curtis W. Frank
Polymer Interfaces and Thin Films: Volume 710
Book
10/2002
Materials Research Society
€57.13
Article exhausted; check different version
Persons
Editor
National Institute of Standards and Technology, Maryland
University of Massachusetts, Amherst
Stanford University, California
University of Wisconsin, Madison