
Si Front-End Processing: Volume 669
Physics and Technology of Dopant-Defect Interactions III
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
356 pages
978-1-107-41220-0 (ISBN)
Description
This book focuses on the phenomena which control the three-dimensional dopant profile in deep submicron devices. As device sizes continue to shrink, increasing the dopant activation while simultaneously decreasing the junction depth requires increasing control and understanding of dopant movement. As dopant diffusion and activation are determined by interactions with defects, other atoms, and interfaces, control of dopant behavior requires specific knowledge of these processes. To take advantage of atomistic simulation methods that can be used to model not only the dopant behaviors but now the properties of whole devices, high-precision advanced characterization techniques (e.g., two-dimensional junction profiling) are essential. These problems provide an excellent opportunity for researchers to share experimental results and physical models, demonstrate their importance to the technologies and identify key issues for future research in this field. Topics include: future device issues; advances in dopant profiling; dopant diffusion issues; dopant-defect clustering; dopant impurity effects; laser annealing; advances in RTA and simulation and modeling.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 19 mm
Weight
480 gr
ISBN-13
978-1-107-41220-0 (9781107412200)
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Schweitzer Classification
Persons
Editor
IBM T J Watson Research Center, New York
University of Florida
Kyoto University, Japan