
Advanced Thermal Management Materials
Springer (Publisher)
Published on 14. September 2012
Book
Hardback
XII, 156 pages
978-1-4614-1962-4 (ISBN)
Description
Advanced Thermal Management Materials
provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
More details
Edition
2013 ed.
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
XII, 156 p.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 15 mm
Weight
424 gr
ISBN-13
978-1-4614-1962-4 (9781461419624)
DOI
10.1007/978-1-4614-1963-1
Schweitzer Classification
Other editions
Additional editions

Guosheng Jiang | Liyong Diao | Ken Kuang
Advanced Thermal Management Materials
Book
10/2014
Springer
€106.99
Shipment within 15-20 days

Guosheng Jiang | Liyong Diao | Ken Kuang
Advanced Thermal Management Materials
E-Book
09/2012
1st Edition
Springer
€96.29
Available for download
Content
Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.