
Polymeric Materials for Microelectronic Applications
Science and Technology
American Chemical Society (Publisher)
Published on 1. January 1995
Book
Hardback
540 pages
978-0-8412-3055-2 (ISBN)
Description
Reports recent developments in polymer science and technology pertinent to microelectronics. Addresses such topics as photophysics and radiation physics and chemistry of polymers; photoresists, electron beam resists, and X-ray resists; insulating materials in microelectronics; photoresponsive materials; silicon-containing polymers; conducting polymers; and optoelectronic materials. Includes international contributions from both academia and industry.
More details
Series
Language
English
Place of publication
Washington
United States
Target group
Professional and scholarly
Dimensions
Height: 235 mm
Width: 156 mm
Thickness: 27 mm
Weight
759 gr
ISBN-13
978-0-8412-3055-2 (9780841230552)
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Schweitzer Classification
Content
Photophysics, Photochemistry, and Photo-optical Effects in Polymer Solids ; Photochemistry of Liquid-Crystalline Polymers ; Dissociative Electron Capture of Polymers with Bridging Acid Anhydrides: Matrix Isolation Electron Spin Resonance Study ; Luminescence Study of Ion-Irradiated Aromatic Polymers ; New Directions in the Design of Chemically Amplified Resist ; Dual-Tone and Aqueous Base Developable Negative Resists Based on Acid-Catalyzed Dehydration ; Importance of Donor-Acceptor Reactions for the Photogeneration of Acid in Chemically Amplified Resists ; Acid Generation in Chemivcally Amplified Resist Films ; Radiation-Induced Reactions of Onium Salts in Novolak ; Polymeric Sulfonium Salts as Acid Generators for Excimer Laser Lithography ; Application of Triaryl Phosphate to Photosensitive Materials: Photoreaction Mechanisms of Triaryl Phosphate ; Effect of Water on the Surface Insoluble Layer of Chemical Amplified Positive Resists ; Thermal Properties of a Chemically Amplified Resist Resin ; Modeling and Simulation of Chemically Amplified Resist Systems ; Surface Imaging Using Photoinduced Acid-Catalyzed Formation of Polysiloxanes at Air-Polymer Interface ; Surface Imaging for Applications to Sub-0.35- m Lithography ; Molecular Design of Epoxy Resins for Microelectronics Packaging ; Uniaxial and In-Plane Molecular Orientation of Polymides and Their Precursor: Studied by Absorption Dichroism of Perylenebisimide Dye ; Novel Photosensitive Polyimide Precursor Based on Polyisoimide Using Nifedipine as A Dissolution Inhibitor ; Photochemical Behavior of Nifedipine Derivatives and Application to Photosensitsive Polyimides ; Waveguiding in High-Temperature-Stable Materials ; Rodlike Fluorinated Polyimide as in In-Plane Birefringent Optical Material ; Preparation of Polyphenylene and Copolymer for Microelectronics Applications ; Charge-Carrier Generation and Migration in a Polydiacetylene compound: Pulse Radiolysis, Time-Resolved Microwave Conductivity Study ; Excitation Dynamics in Conjugated Polymers ; Application of Polyaniline Films to Radiation Dosimetry ; Present and Future of Fullerenes: C[6[0 nd Tubules ; Photoresponsive Liquid-Crystalline Polymers: Holographic Storage, Digital Storage, and Holographic Optical Components ; Azimuthal Alighment Photocontrol of Piquid Crystals ; Electronic Structure and UV Absorption Spectra of Permethylated Silicon Chains ; Electronic Properties of Polysilanes ; UV Photoelectron Spectroscopy of Polysilanes and Polygermanes ; Radical Ions of Polysilynes ; Optical Properties of SIlicon-Based Polymers with Different Backbone Structures ; Synthesis and Properties of Polysilanes Prepared by Ring-Opening Polymerization ; New Synthesis and Functionalization of Photosensitive Poly(silylether) by Addition Reaction of Bisepoxide with Dichlorosilane