International Conference on Wafer Scale Integration, 1993 Proceedings
Published on 15. June 2006
Book
Hardback
374 pages
978-0-7803-0867-1 (ISBN)
More details
Language
English
Place of publication
Piscataway NJ
United States
Target group
College/higher education
Professional and scholarly
Dimensions
Height: 241 mm
Width: 165 mm
Thickness: 25 mm
Weight
680 gr
ISBN-13
978-0-7803-0867-1 (9780780308671)
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