
Integration of 2D Materials for Electronics Applications
MDPI (Publisher)
1st Edition
Published on 12. February 2019
Book
Paperback/Softback
264 pages
978-3-03897-606-6 (ISBN)
Description
Two-dimensional (2D) materials and their vertical/lateral heterostructures are currently the subject of massive research interests, both for fundamental science and for technological applications in diverse fields, such as electronics, optoelectronics, quantum metrology, spintronics, membranes, energy conversion/storage, and sensing. Integration of 2D materials within real device structures currently represents the main challenge to move from the laboratory stage to industrial applications, especially in the fields of electronics/optoelectronics.
This Book is a collection of 9 papers, covering the different key topics of this rapidly developing research field. These include: synthesis of 2D materials, progress in relevant processing issues (contact, doping and mobility engineering), advanced characterization techniques, novel device applications based on the integration of these 2D materials.
Many of the papers of this collection are review papers, providing the general introductory information and a broad overview of the most recent advances in the specific topic. Hence, this book can serve both as a general introduction for non-experts in the field and as a guide for scientists/engineers working in the field of 2D materials integration.
This Book is a collection of 9 papers, covering the different key topics of this rapidly developing research field. These include: synthesis of 2D materials, progress in relevant processing issues (contact, doping and mobility engineering), advanced characterization techniques, novel device applications based on the integration of these 2D materials.
Many of the papers of this collection are review papers, providing the general introductory information and a broad overview of the most recent advances in the specific topic. Hence, this book can serve both as a general introduction for non-experts in the field and as a guide for scientists/engineers working in the field of 2D materials integration.
More details
Language
English
Place of publication
Basel
Switzerland
Target group
College/higher education
Professional and scholarly
Professionals/Scholars
Edition type
New edition
Product notice
Klappenbroschur
Illustrations
Illustrations
Dimensions
Height: 24.4 cm
Width: 17 cm
Thickness: 18 mm
Weight
572 gr
ISBN-13
978-3-03897-606-6 (9783038976066)
DOI
10.3390/books978-3-03897-607-3
Schweitzer Classification
Persons
Guest editor
Consiglio Nazionale delle Ricerche -Institute for Microelectronics and Microsystems (CNR-IMM), Strada VIII, 5 I-95121 Catania, Italy
Department of Microtechnology and Nanoscience, Chalmers University of Technology, S-412 96 Göteborg, Sweden
Sensor and Actuator Systems, IFM, Department of Physics, Chemistry, and Biology, Linköping University, SE 58183, Sweden
Institute for Molecular Engineering, The University of Chicago, Eckhardt Research Center, 5640 South Ellis Avenue, Chicago, IL 60637 USA