The focus of this book develops around HW, and in particular on low-complexity components for Radio Frequency (RF) applications. To this end, Microsystem (MEMS) technology for RF passive components, known as RF-MEMS, is employed, discussing its potentialities in the application frame of 5G.
The approach adopted is practical, and a significant part of the content can be directly used by scientists involved in the field, to put their hand on actual design, optimization and development of innovative RF passive components in MEMS technology for 5G and beyond applications. This update (which includes a review of the main approaches to the modelling and simulations of MEMS and RF-MEMS devices) is timely and will find a wider readership as it crosses into the translational aspects of applied research in the subject.
Key Features:
- With over 50 pages of new content, the book will be 1/3 larger than the 1st edition.
- New chapter on simulation and modelling techniques.
- Practical approach to the design and development of RF-MEMS design concepts for 5G and upcoming 6G.
- Includes a review of the business landscape.
Series
Edition
Language
Place of publication
Target group
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Illustrations
With figures in colour and black and white
Dimensions
Height: 254 mm
Width: 178 mm
Thickness: 16 mm
Weight
ISBN-13
978-0-7503-4197-4 (9780750341974)
DOI
10.1088/978-0-7503-4199-8
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Jacopo Iannacci is an expert in Microsystem Technologies (MEMS) for diverse applications. He received the MSc Degree in Electronic Engineering (2003) and the PhD in Information Technology (2007) from the ARCES Research Center at the University of Bologna, Italy, and worked as Visiting Researcher (2005-2006) at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on the development of packaging and integration solutions for RF-MEMS devices. He authored and co-authored numerous scientific contributions for international journals and conference proceedings, as well as books and several book chapters in the field of MEMS and RF-MEMS technology. In 2007 he joined the Research Staff of the Center for Sensors and Devices (SD) at Fondazione Bruno Kessler (FBK) in Trento, Italy. Since then he focuses on (compact) modelling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for Sensors/Actuators, Energy Harvesting and Telecommunication systems and applications
Author
Center for Materials and Microsystems, Fondazione Bruno Kessler, Trento, Italy
