Process Variations in Microsystems Manufacturing
Published on 10. April 2020
Book
Hardback
XIX, 521 pages
978-3-030-40558-8 (ISBN)
Description
This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level.
More details
Series
Edition
2020 ed.
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Illustrations
24 farbige Abbildungen, 212 s/w Abbildungen
XIX, 521 p. 236 illus., 24 illus. in color.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 35 mm
Weight
975 gr
ISBN-13
978-3-030-40558-8 (9783030405588)
DOI
10.1007/978-3-030-40560-1
Schweitzer Classification
Other editions
Additional editions
Michael Huff
Process Variations in Microsystems Manufacturing
E-Book
04/2020
1st Edition
Springer
€149.79
Available for download
Person
Michael A. Huff,
Ph.D., is Founder and Director of the MEMS & Nanotechnology Exchange (MNX) in Reston, Virginia. The MNX was established as a national-level program to provide access to MEMS implementation resources as well as to develop manufacturing techniques to help advance the technology. Dr. Huff has actively participated in MEMS research and development for over twenty-five years, has published numerous papers on MEMS devices and fabrication technologies, and holds more than a dozen patents and has several others pending. He has held a variety of notable positions, from industry to academia. Prior to establishing the MNX, Dr. Huff was on the faculty in the Department of Electrical Engineering at Case Western Reserve University (CWRU) in Cleveland, Ohio. Before joining the faculty at CWRU, he held the position of Technical Fellow at the Baxter Healthcare Corporation and directed Baxter's corporate-wide efforts in applying MEMS technology to novel medical devices. Dr.Huff received an M.S. in Electrical Engineering and Computer Science and simultaneously the M.S. in Material Science and Engineering with a specialization in Electronic Materials and a Ph.D. in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology.
Content
Introduction.- Overview of Microsystems Manufacturing.- Process Variations in Microsystems Processing Steps.- Microsystems Metrology Methods and Associated Errors.- Process Integration and Variations in Material Properties.- Device Parameter Variations in Microsystems Manufacturing.- Quality Assurance and Control Methods Used in Microsystems Manufacturing.- Design Methods for Handling Process Variations.- Future Methods for Improved Microsystems Manufacturing Process Variations.