
ESSDERC '89
19th European Solid State Device Research Conference, Berlin
Springer (Publisher)
Published on 1. July 2012
Book
Paperback/Softback
XXV, 963 pages
978-3-642-52316-8 (ISBN)
Description
The conference
ESSDERC '89
held in September 1989 in Berlin was concerned with the physics, electrical characteristics, reliability and processing of solid state devices and electronic materials. The proceedings contain all invited and contributed papers of the conference and thus becomes a state-of-the-art-report of solid state device research in Europe 1989.
More details
Edition
Softcover reprint of the original 1st ed. 1989
Language
English
Place of publication
Berlin
Germany
Publishing group
Springer Berlin
Target group
Professional and scholarly
Research
Illustrations
264 s/w Abbildungen
XXV, 963 p. 264 illus.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 53 mm
Weight
1475 gr
ISBN-13
978-3-642-52316-8 (9783642523168)
DOI
10.1007/978-3-642-52314-4
Schweitzer Classification
Other editions
Additional editions
Anton Heuberger | Heiner Ryssel | Peter Lange
ESSDERC '89
19th European Solid State Device Research Conference, Berlin
Book
09/1989
Springer
€85.59
Article exhausted; check different version
Content
From the Contents: Silicon and Compound Semiconductor Devices: MOS and Bipolar Structures.- New Devices, Submicron Devices.- III-V and II-VI Devices.- Quantum Well Devices and Heterostructures.- Lasers and Photodetectors.- Integrated Optoelectronics.- Sensors.- Cryogenic Devices.- Device Modelling.- Device Characterization.- Radiation Damage, Radiation Hardening.- Superconductivity in Semiconductor Devices.- Silicon and Compound Semiconductor Technology: Technology on III-V and II-VI Compounds.- Epitaxy Processes (LPE, MBE, MO-CVD,...).- Deposition Processes.- Plasma Processes.- Rapid Thermal Annealing.- Submicron Lithography.- Passivation.- Non-destructive Testing of Wafers, Layers, Devices.- Reliability and Defects.- Process Modelling.