
Microelectronic Processing
Chemical Engineering Aspects
American Chemical Society (Publisher)
Published on 1. January 1989
Book
Hardback
524 pages
978-0-8412-1475-0 (ISBN)
Description
Although chemical engineering principles are at the heart of solid state process technology, until now no reference volume addressing this relationship was available. This is the first book of its kind to tie fundamental engineering concepts to solid state process technology. Discussing the basic concepts involved-liquid-phase epitaxy, physical and chemical vapor deposition, diffusion and oxidation in silicon, resists in microlithography, etc.-this volume will be
particularly useful in chemical engineering courses. It offers a framework within which specialized courses in microelectronics processing can be organized. In addition, it serves as a valuable reference source for all industrial engineers working with the individual process steps
covered.
particularly useful in chemical engineering courses. It offers a framework within which specialized courses in microelectronics processing can be organized. In addition, it serves as a valuable reference source for all industrial engineers working with the individual process steps
covered.
More details
Series
Language
English
Place of publication
Washington
United States
Target group
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 232 mm
Width: 159 mm
Thickness: 32 mm
Weight
898 gr
ISBN-13
978-0-8412-1475-0 (9780841214750)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Content
Microelectronics Processing ; Theory of Transport Processes in Semiconductor Crystal Growth from the Melt ; Liquid-Phase Epitaxy and Phase Diagrams of Compound Semiconductors ; Physical Vapor Deposition Reactors ; Chemical Vapor Deposition ; Diffusion and Oxidation of Silicon ; Resists in Microlithography ; Plasma-Enhanced Etching and Deposition ; Interconnection and Packaging of High-Performance Integrated Circuits ; Semiconductor Processing Problems Solved by Wet (Solution) Chemistry