Dependable Embedded Systems
Published on 10. December 2020
Book
Hardback
XIII, 608 pages
978-3-030-52016-8 (ISBN)
Description
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today's points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.
- Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;
- Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;
- Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
More details
Product info
Book
Series
Edition
1st ed. 2021
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Illustrations
150 farbige Tabellen, 43 s/w Abbildungen, 250 farbige Abbildungen
150 Tables, color; 250 Illustrations, color; 43 Illustrations, black and white; XIII, 608 p. 293 illus., 250 illus. in color.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 39 mm
Weight
1092 gr
ISBN-13
978-3-030-52016-8 (9783030520168)
DOI
10.1007/978-3-030-52017-5
Schweitzer Classification
Other editions
Additional editions
Joerg Henkel | Nikil Dutt
Dependable Embedded Systems
Book
02/2022
Springer
€74.27
Shipment within 5-7 days
Persons
Prof. Jörg Henkel is with Karlsruhe Institute of Technology (KIT), Germany, where he is directing the Chair for Embedded Systems CES. Before, he was a Senior Research Staff Member at NEC Laboratories in Princeton, NJ. He received his PhD from Braunschweig University with "Summa cum Laude". Prof. Henkel has/is organizing various embedded systems and low power ACM/IEEE conferences/symposia as General Chair and Program Chair and was a Guest Editor on these topics in various Journals like the IEEE Computer Magazine. He was Program Chair of CODES'01, RSP'02, ISLPED'06, SIPS'08, CASES'09, Estimedia'11, VLSI Design'12, ICCAD'12, PATMOS'13, NOCS'14 and served as General Chair for CODES'02, ISLPED'09, Estimedia'12, ICCAD'13 and ESWeek'16. He is/has been a steering committee member of major conferences in the embedded systems field like at ICCAD, ESWeek, ISLPED, Codes+ISSS, CASES and is/has been an editorial board member of various journals like the IEEE TVLSI, IEEE TCAD, IEEE TMSCS, ACM TCPS, JOLPE etc.
In recent years, Prof. Henkel has given more than ten keynotes at various international conferences primarily with focus on embedded systems dependability. He has given full/half-day tutorials at leading conferences like DAC, ICCAD, DATE etc. Prof. Henkel received the 2008 DATE Best Paper Award, the 2009 IEEE/ACM William J. Mc Calla ICCAD Best Paper Award, the Codes+ISSS 2015, 2014, and 2011 Best Paper Awards, and the MaXentric Technologies AHS 2011 Best Paper Award as well as the DATE 2013 Best IP Award and the DAC 2014 Designer Track Best Poster Award. He is the Chairman of the IEEE Computer Society, Germany Section, and was the Editor-in-Chief of the ACM Transactions on Embedded Computing Systems (ACM TECS) for two consecutive terms. He is an initiator and the coordinator of the German Research Foundation's (DFG) program on 'Dependable Embedded Systems' (SPP 1500). He is the site coordinator (Karlsruhe site) of the Three-University Collaborative Research Center on "Invasive Computing" (DFG TR89). He is the Editor-in-Chief of the IEEE Design&Test Magazine. He holds ten US patents and is a Fellow of the IEEE.
Content
Introduction.- Design of efficient, dependable SoCs based on cross-layer-reliability approach with emphasis on wireless communication as application and DRAM memories.- CRAU: Compositional System-Level Reliability Analysis in the Presence of Uncertainties.- Semantics-aware Soft Error Handling for Embedded Systems using Compiler-OS Interaction.- ARES: Self-Adaptive Coarse-Grained Reconfigurable Architectures as Reliability Enhancers in Embedded Systems.- Cross-Layer Techniques for Dependable Software Execution on Embedded Systems.- Ambrosia: Cross-layer Modeling and Mitigation of Aging Effects in Embedded Systems.- Cross-Layer Dependability for Embedded Hardware/Software Systems.- Fault-Tolerant Computing with Heterogeneous Hardware/Software Hardening Modes.- Robust Computing for Machine Learning-Based Systems.- Hardening embedded system software.- LIFT: Lifting Device-Level Characteristics for Error Resilient System Level Design: A Crosslayer Approach.- VirTherm-3D: Communication Virtualization Enabling System Management for Dependable 3D MPSoCs.- OTERA: Online Test Strategies for Reliable Reconfigurable Architectures.- Variability-Aware Software: Recent Results and Contributions.- EM Lifetime Constrained Optimization for Multi-Segment Power Grid Networks.- Lightweight Software-Assisted Memory Error Correction.- Reliability-Driven Resource Management for Multi-Core Systems-on-Chip.- Monitor Circuits for Device-Circuit Interaction.- PERCIES: Providing Efficient Reliability in Critical Embedded Systems.