Electronic Packaging and Interconnection Handbook
2nd Edition
Published on 7. November 1996
Book
Hardback
900 pages
978-0-07-026694-0 (ISBN)
Description
Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.
More details
Edition
2nd Revised edition
Language
English
Place of publication
New York
United States
Publishing group
McGraw-Hill Education - Europe
Target group
Professional and scholarly
Edition type
Revised edition
Illustrations
Illustrations
Dimensions
Height: 230 mm
Weight
1325 gr
ISBN-13
978-0-07-026694-0 (9780070266940)
Copyright in bibliographic data is held by Nielsen Book Services Limited or its licensors: all rights reserved.
Schweitzer Classification
Other editions
New editions
Charles Harper
Electronic Packaging and Interconnection Handbook
Book
03/2000
3rd Edition
McGraw-Hill Professional
€113.88
Article exhausted; check for reprint
Content
Materials; thermal management; connectors; wiring and cabling; solders and soldering; rigid and flexible printed circuits; surface mount technology; hybrid microelectronics and MCMs; TAB, Flip Chip and BGA; packaging of high speed and microwave electronic systems; packaging of high voltage electronic systems.