WireBonding In Microelectronics 3/e SET 2

The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies completely updatedWire bonding is the attachment of fine wires from semiconductor chips to their substrates-a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics. Wire Bonding in Microelectronics, Third Edition, equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Third Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,