Simulation of Semiconductor Processes and Devices 2007
Published on 25. August 2008
Book
Paperback/Softback
480 pages
978-3-211-10070-7 (ISBN)
More details
Language
English
Place of publication
United States
Product notice
Paperback (trade)
Unsewn / adhesive bound
Dimensions
Height: 170 mm
Width: 244 mm
Thickness: 25 mm
Weight
757 gr
ISBN-13
978-3-211-10070-7 (9783211100707)
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