
Electrically Based Microstructural Characterization III: Volume 699
Materials Research Society (Publisher)
Published on 5. September 2002
Book
Hardback
376 pages
978-1-55899-635-9 (ISBN)
Description
This book, first published in 2002, focuses on the application of electrical measurements as a nondestructive tool for microstructural characterization. Papers show how the usage of dc- and ac- resistivity measurements, complex impedance analysis, ellipsometry, and capacitance-voltage measurements are used to assess phase transformations, presence of grain boundary layers with different electrical response, anisotropy, mechanical degradation, and presence of defects and porosity in a wide range of materials and devices. The development of scanning impedance imaging by applying a lateral bias to an AFM specimen opens up many opportunities for simultaneous electrical property and microstructural data acquisition. This is the first time that impedance spectroscopy has been used to characterize metallic alloys in the metallic state, in the absence of liquid electrolytes. Papers focus on characterizing components in various microelectronic devices, with an emphasis on materials interpretation rather than device interpretation. Topics include: electrically inhomogeneous materials; advances in experimental methods and interpretation; microelectronic applications; metals and alloys and amorphous materials.
This book, first published in 2002, focuses on the application of electrical measurements as a nondestructive tool for microstructural characterization. Papers show how the usage of dc- and ac- resistivity measurements, complex impedance analysis, ellipsometry, and capacitance-voltage measurements are used to assess phase transformations, presence of grain boundary layers with different electrical response, anisotropy, mechanical degradation, and presence of defects and porosity in a wide range of materials and devices. The development of scanning impedance imaging by applying a lateral bias to an AFM specimen opens up many opportunities for simultaneous electrical property and microstructural data acquisition. This is the first time that impedance spectroscopy has been used to characterize metallic alloys in the metallic state, in the absence of liquid electrolytes. Papers focus on characterizing components in various microelectronic devices, with an emphasis on materials interpretation rather than device interpretation. Topics include: electrically inhomogeneous materials; advances in experimental methods and interpretation; microelectronic applications; metals and alloys and amorphous materials.
This book, first published in 2002, focuses on the application of electrical measurements as a nondestructive tool for microstructural characterization. Papers show how the usage of dc- and ac- resistivity measurements, complex impedance analysis, ellipsometry, and capacitance-voltage measurements are used to assess phase transformations, presence of grain boundary layers with different electrical response, anisotropy, mechanical degradation, and presence of defects and porosity in a wide range of materials and devices. The development of scanning impedance imaging by applying a lateral bias to an AFM specimen opens up many opportunities for simultaneous electrical property and microstructural data acquisition. This is the first time that impedance spectroscopy has been used to characterize metallic alloys in the metallic state, in the absence of liquid electrolytes. Papers focus on characterizing components in various microelectronic devices, with an emphasis on materials interpretation rather than device interpretation. Topics include: electrically inhomogeneous materials; advances in experimental methods and interpretation; microelectronic applications; metals and alloys and amorphous materials.
More details
Series
Language
English
Place of publication
New York
United States
Illustrations
Worked examples or Exercises
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 22 mm
Weight
670 gr
ISBN-13
978-1-55899-635-9 (9781558996359)
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Schweitzer Classification
Persons
Editor
Georgia Institute of Technology
Alabama Agricultural and Mechanical University
Pohang University of Science and Technology, Republic of Korea