
Robotic Micro-Assembly
Wiley-IEEE Press
Will be published approx. on 24. September 2010
Book
Hardback
328 pages
978-0-470-48417-3 (ISBN)
Description
Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve highperformance MEMS. Two approaches are currently developed for microassembly: selfassembly and robotic microassembly. This text presents a complete overview of robotic microassembly, from microworld modeling and handling strategies, to the design of microassembly robotic devices and microassembly methods. The coverage features micromanipulation and microrobotic assembly, including automation, with many examples. This resource presents an objective view of robotic assembly by eight authors based in eight different research institutes involved in microassembly worldwide.
More details
Product info
gebunden
Edition
1. Auflage
Language
English
Place of publication
United States
Publishing group
John Wiley & Sons Inc
Target group
Professional and scholarly
Product notice
sewn/stitched
Cloth over boards
Illustrations
Drawings: 118 B&W, 0 Color; Screen captures: 54 B&W, 0 Color
Dimensions
Height: 240 mm
Width: 161 mm
Thickness: 22 mm
Weight
657 gr
ISBN-13
978-0-470-48417-3 (9780470484173)
Schweitzer Classification
Other editions
Additional editions

Michaël Gauthier | Stéphane Régnier
Robotic Micro-Assembly
E-Book
01/2011
Wiley-IEEE Press
€126.99
Available for download

Michaël Gauthier | Stéphane Régnier
Robotic Micro-Assembly
E-Book
08/2010
Wiley-IEEE Press
€126.99
Available for download
Persons
MICHAËL GAUTHIER, PhD, is a researcher at the Centre National de la Recherche Scientifique (CNRS), working with the Automation and Micromechatronic Systems Department in the FEMTO-ST Institute in France. His research interests focus on the modeling and study of automatic micromanipulation strategies, with an emphasis on artificial microobjects under 50 ?m.
STÉPHANE RÉGNIER, PhD, is Professor as well as head of the micromanipulation team at the Institut des Systèmes Intelligents et Robotique (ISIR) in France. His research examines microscale phenomena such as micromechatronics and biological cell micromanipulation.
Content
Preface.
Introduction.
PART I MODELING OF THE MICROWORLD.
1 Microworld modeling in Vacuum and Gaseous Environments.
1.1 Introduction.
1.2 Classical models.
1.3 Recent developments.
References.
2 Microworld Modelling: Impact of liquid and roughness.
2.1 Introduction.
2.2 Liquid environments.
2.3 Microscopic analysis.
2.4 Surface Roughness.
References.
PART II HANDLING STRATEGIES.
3 Unified view of robotic microhandling and selfassembly.
3.1 Background.
3.2 Robotic Microhandling.
3.3 SelfAssembly.
3.4 Components of Microhandling.
3.5 Hybrid Microhandling.
3.6 Conclusion.
References.
4 Towards a precise micro manipulation.
4.1 Introduction.
4.2 Handling principles and strategies adapted to the microworld.
4.3 Micromanipulation setup.
4.4 Experimentations.
4.5 Conclusion.
References.
5 Microhandling Strategies and Microassembly in Submerged.
Medium.
5.1 Introduction.
5.2 Dielectrophoretic Gripper.
5.3 Submerged freeze gripper.
5.4 Chemical control of the release in submerged handling.
5.5 Release on adhesive substrate and microassembly.
5.6 Conclusion.
References.
PART III ROBOTIC AND MICROASSEMBLY.
6 Robotic microassembly of 3D MEMS Structures.
6.1 Introduction.
6.2 Methodology of the Microassembly System.
6.3 Robotic Micromanipulator.
6.4 Overview of Microassembly System.
6.5 Modular Design Features for Compatibility with the Microassembly System.
6.6 Grasping Interface (Interface Feature).
6.7 PMKIL Microassembly Process.
6.8 Experimental Results and discussion.
6.9 Conclusion.
References.
7 High Yield Automated MEMS Assembly.
7.1 Introduction.
7.2 General Guidelines for 2 1 2D Microassembly.
7.3 Compliant Part Design.
7.4 3 Microassembly System.
7.5 High Yield Microassembly.
7.6 Conclusion and Future work.
References.
8 Design of a desktop microassembly machine and its industrial.
application to micro solder ball manipulation.
8.1 Introduction.
8.2 Outline of the machine design to achieve fine accuracy.
8.3 Application to the joining process of electric Components.
8.4 Pursuing higher accuracy.
8.5 Conclusion.
References.