Design, Characterization, and Packaging for MEMS and Microelectronics II
SPIE Press
Published on 1. January 2001
Book
Paperback/Softback
332 pages
978-0-8194-4323-6 (ISBN)
More details
Series
Edition
New ed.
Language
English
Place of publication
Bellingham
United States
Target group
Professional and scholarly
ISBN-13
978-0-8194-4323-6 (9780819443236)
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Schweitzer Classification