
Epoxy Resins and Composites IV
Karel Dusek(Editor)
Springer (Publisher)
1st Edition
Published on 1. August 1986
Book
Hardback
XIII, 220 pages
978-3-540-16423-4 (ISBN)
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Series
Language
English
Place of publication
Heidelberg
Germany
Publishing group
Springer Berlin
Target group
College/higher education
Professional and scholarly
Research
Illustrations
XIII, 220 p.
Dimensions
Height: 0 mm
Width: 0 mm
Weight
545 gr
ISBN-13
978-3-540-16423-4 (9783540164234)
DOI
10.1007/3-540-16423-5
Schweitzer Classification
Other editions
Additional editions

Persons
Editor
Contributions
Content
Dielectric analysis of thermoset cure.- Epoxy-aromatic amine networks in the glassy state structure and properties.- Void growth and resin transport during processing of thermosetting - Matrix composites.- Physical aging in epoxy matrices and composites.- Curing mechanisms and mechanical properties of cured epoxy resins.