
Substrate Noise Coupling in Mixed-Signal ASICs
Springer (Publisher)
Published on 7. December 2010
Book
Paperback/Softback
XXXI, 287 pages
978-1-4419-5341-4 (ISBN)
Description
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Reviews / Votes
From the reviews:
"This book covers modeling and simulation for the noise from substrate. This book reviews the causes of noise in substrate and possible prevention of the noise. . As a practicing engineer, I feel that their techniques for noise prevention are legitimate and applicable. This book is worthwhile for IC design engineers. Those engineers that work on integration of analog and digital parts may want to read this book to prevent any malfunctioning ICs." (IEEE Circuits & Devices Magazine, Vol. 20 (5), September/October, 2004)
More details
Edition
1st ed. Softcover of orig. ed. 2003
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
XXXI, 287 p.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 18 mm
Weight
493 gr
ISBN-13
978-1-4419-5341-4 (9781441953414)
DOI
10.1007/b105382
Schweitzer Classification
Other editions
Additional editions

Stéphane Donnay | Georges Gielen
Substrate Noise Coupling in Mixed-Signal ASICs
E-Book
05/2006
Plenum Publishing Corporation
€149.79
Available for download

Stéphane Donnay | Georges Gielen
Substrate Noise Coupling in Mixed-Signal ASICs
Book
02/2003
Kluwer Academic Publishers
€160.49
Shipment within 15-20 days
Content
Technology Impact on Substrate Noise.- Substrate Noise Generation in Complex Digital Systems.- Modeling and Analysis of Substrate Noise Coupling in Mixed-Signal ICs.- SPACE for Substrate Resistance Extraction.- Models and Parameters for Crosstalk Simulation.- High-Level Simulation of Substrate Noise Generation in Complex Digitlal Systems.- Modeling the Impact of Digital Substrate Noise on Analog Integrated Circuits.- Measuring and Modeling the Effects of Substrate Noise on the LNA for a CMOS GPS Receiver.- A Practical Approach to Modeling Silicon-Crosstalk in Systems-on-Silicon.- The Reduction of Switching Noise Using CMOS Current Steering Logic.- Low-Noise Digital Design Techniques.- How to Deal with Substrate Bounce in Analog Circuits in Epi-Type CMOS Technology.- Reducing Substrate Bounce in CMOS RF-Circuitry.