
Advances in CMP Polishing Technologies
William Andrew Publishing
Published on 20. December 2011
Book
Hardback
328 pages
978-1-4377-7859-5 (ISBN)
Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community.
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience.
Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries.
More details
Language
English
Place of publication
Norwich
United States
Target group
Professional and scholarly
Cluster E-brochure, trade shows and conferences, online display ads, 2x-Email blast to in-house subs
Product notice
Laminated cover
Dimensions
Height: 239 mm
Width: 156 mm
Thickness: 25 mm
Weight
591 gr
ISBN-13
978-1-4377-7859-5 (9781437778595)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Toshiro Doi | Ioan D. Marinescu | Syuhei Kurokawa
Advances in CMP Polishing Technologies
Book
10/2018
William Andrew Publishing
€142.60
The article will not be published

Toshiro Doi | Ioan D. Marinescu | Syuhei Kurokawa
Advances in CMP Polishing Technologies
E-Book
11/2011
William Andrew
€137.00
Available for download
Persons
Ioan D. Marinescu is Professor and Director of the Precision Micromachining Center at The University of Toledo, Ohio, USA, and CEO of Advanced Manufacturing Solutions, LLC. His research interests include manufacturing processes, grinding, tribology, advanced materials, and machining of brittle materials.
Editor
Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan
Professor and Director, Precision Micromachining Center, The University of Toledo, Toledo, OH, USA
Content
Chapter 1: Introduction
Chapter 2: Device fabrication with a silicon crystal substrate
Chapter 3: Ultra-precision technology - taking silicon single crystal as an example
Chapter 4: Applications of ultra-precision CMP in device processes
Chapter 5: The future of processing technology
Chapter 6: Progress of the semiconductor and silicon industries
Chapter 7: Summary
Chapter 2: Device fabrication with a silicon crystal substrate
Chapter 3: Ultra-precision technology - taking silicon single crystal as an example
Chapter 4: Applications of ultra-precision CMP in device processes
Chapter 5: The future of processing technology
Chapter 6: Progress of the semiconductor and silicon industries
Chapter 7: Summary