Embedded Systems Design with the Texas Instruments MSP432 32-bit Processor

Dung Dang has served as an applications engineer for Texas Instruments since 2007. He has served in various positions with the MSP430 and MSP432 microcontroller product lines and now serves as the MSP432 Platform Marketing Manager. He is an advocate of open-source platforms to allow ready adoption of microcontroller innovations in education and industry. He is the technical founder of the TI LaunchPad ecosystem. His service has taken him worldwide for customer field training and support. On a daily basis he collaborates with teams in Germany, India, China, and the U.S. Dung Dang holds an MSEE degree from Saint Mary's University at San Antonio, concentrating on embedded systems and image processing. He served as a Research Assistant at Saint Mary's for two years.Daniel J. Pack is the Dean of the College of Engineering and Computer Science at the University of Tennessee, Chattanooga (UTC). Prior to joining UTC, he was Professor and Mary Lou Clarke Endowed Chair of the Electrical and Computer Engineering Department at the University of Texas, San Antonio, after serving as Professor (now Professor Emeritus) of Electrical and Computer Engineering at the United States Air Force Academy (USAFA), CO, where he served as Director of the Academy Center for Unmanned Aircraft Systems Research. He received a Bachelor of Science degree in Electrical Engineering, a Master of Science degree in Engineering Sciences, and a Ph.D. degree in Electrical Engineering from Arizona State University, Harvard University, and Purdue University, respectively. He also spent a year as a visiting scholar at the Massachusetts Institute of Technology-Lincoln Laboratory. Dr. Pack has co-authored seven textbooks on embedded systems (including 68HC12 Microcontroller: Theory and Applications and Embedded Systems: Design and Applications with the 68HC12 and HCS12) and published over 130 book chapters, technical journal/transactions, and conference papers on unmanned systems, cooperative control, robotics, pattern recognition, and engineering education. He is the recipient of a number of teaching and research awards including Carnegie U.S. Professor of the Year Award, Frank J. Seiler Research Excellence Award, Tau Beta Pi Outstanding Professor Award, Academy Educator Award, and Magoon Award. He is a member of Eta Kappa Nu (Electrical Engineering Honorary), Tau Beta Pi (Engineering Honorary), IEEE (senior member), and the American Society of Engineering Education. He is a registered Professional Engineer in Colorado and currently serves as Editor-at-Large for Journal of Intelligent & Robotic Systems and as Associate Editor for IEEE Systems Journal. His research interests include unmanned aerial vehicles, intelligent control, automatic target recognition, robotics, and engineering education.Steven F. Barrett, Ph.D., P.E., received a B.S. in Electronic Engineering Technology from the University of Nebraska Lincoln (Omaha campus) in 1979, a M.E. in Electrical Engineering from the University of Idaho at Moscow in 1986, and a Ph.D. in Electrical Engineering from The University of Texas at Austin in 1993. He was formally an active duty faculty member at the United States Air Force Academy, Colorado and now serves as the Associate Dean of Academic Programs and professor of electrical and computer engineering at the University of Wyoming. He is a member of IEEE (senior) and Tau Beta Pi (chief faculty advisor). His research interests include digital and analog image processing, computer-assisted laser surgery, and embedded controller systems. He is a registered Professional Engineer in Wyoming and Colorado and serves on the Wyoming State Board of Professional Engineers and Surveyors. He has co-written several textbooks on microcontrollers and embedded systems. In 2004, Barrett was named ""Wyoming Professor of the Year"" by the Carnegie Foundation for the Advancement of Teaching and in 2008 was the recipient of the National Society of Professional Engineers (NSPE) Professional Engineers in Higher Education, Engineering Education Excellence Award.