Integrated Optoelectronics
Academic Press
Published on 1. January 1995
Book
Hardback
688 pages
978-0-12-200420-9 (ISBN)
Description
Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries, with applications in a variety of areas, from consumer electronics to high performance information networks. The requiremets for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides and overview of this technology. Focusing on the theme of integration, contributors discuss the intimate trade-offs between materials, processes, devices, functional blocks, packaging, and systems requirements. This integration encompasses electrical, optoelectronic, and optical devices onto monolithic or hybrid chips, and into multichip modules.
Key features of this text include: new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chips; coverage of planar processes laser fabrication leading to wafer level automated testing; optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chips; design approaches for multi-functional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICs; and coverage of the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips.
Key features of this text include: new information on device fabrication, including the latest epitaxial growth and lift-off techniques to permit the mixing of dissimilar materials onto single chips; coverage of planar processes laser fabrication leading to wafer level automated testing; optimization of devices for integration, including a detailed treatment of the vertical emitting laser and theoretical and experimental coverage of optimization of photodetectors for integration into receiver chips; design approaches for multi-functional chips, including photonic circuits for all-optical networks and the design of integrated optoelectronic chips with lasers, photodiodes, and electronic ICs; and coverage of the infrastructure needed to support an integrated technology, including automated design systems which treat both optical and electrical circuits, and multichip packaging approaches for both optical and IC chips.
More details
Series
Language
English
Place of publication
San Diego
United States
Publishing group
Elsevier Science Publishing Co Inc
Target group
College/higher education
Professional and scholarly
Illustrations
index
Dimensions
Height: 234 mm
Width: 157 mm
Weight
1103 gr
ISBN-13
978-0-12-200420-9 (9780122004209)
Copyright in bibliographic data is held by Nielsen Book Services Limited or its licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

Persons
Editor
Bellcore, Redbank, New Jersey, USA
IBM T.J. Watson Research Center, Yorktown Heights, New York, USA
Content
Systems Requirements for OEICS: The Need for OEICs in Lightwave Networks, M.S. Goodman and E. Arthurs; Computing-System Applications for Optoelectronic Integrated Circuits, J.D. Crow, J.M. Jaffe, and M. W. Sachs; Materials Grow: Molecular Beam Epitaxy with Gaseous Sources, J.D. Crow, J.M. Jaffe, and M. W. Sachs; Organometallic Chemical Vapour Deposition for Optoelectronic Integrated Circuits, R. Bhat; Lattice Mismatched Hetero-Epitaxy, S.F. Fang and H. Morkoc; Devices Processing: Focused Ion Beam Fabrication Techniques for Optoelectronics, L.R. Harriott and H. Temkin; Full Water Technology for Large Scale Laser Fabrication and Integration, P. Vettiger, P. Buchmann, O. Voegeli, and D. J. Webb; Epitaxial Lift-Off, W. Chan and E. Yablonovitch; State of the Art Discrete Components: Electronic Devices for OEICs, J.R. Hayes; Lasers and Modulators for EOICs, L. A. Coldren; Photodetectors for Optoelectronic Integrated Circuits, J. C. Campbell; Optoelectronic Integrated Circuits (OEICs): Current Status of OEICs, O. Wada and J. Crow; Scaling and System Issues of OEIC Design, R. Bates, J. Crow, J. Ewen, and D. Rogers; Modelling for Optoelectronic Integrated Circuits, R. Bates, D. Botteldooren, G. Morthier, F. Libbrecht, and P. Lagasse; Photonic Integrated Circuits, T. L. Koch and U. Koren; Future OEICs: The Basis for the Photo-Electronic Integrated System, I. Hayashi.