Comprehensive Microsystems
Elsevier (Publisher)
2nd Edition
Published on 23. June 2025
Book
1944 pages
978-0-323-95478-5 (ISBN)
Description
The microsystems field has expanded to embrace a host of technologies, and microelectronics has now been joined by micro-mechanics, micro-fluidics and micro-optics to allow the fabrication of complex, multi- functional integrated microsystems. Comprehensive Microsystems, Second Edition, Three Volume Set, represents the authoritative primary reference source on microsystems and is now newly updated to reflect the latest advances in this exciting engineering field. This major reference work provides an exhaustive overview of the range of topics which comprise the microsystems field, including, design and materials, fabrication and packaging, optical systems, chemical and biological systems, physical sensors, actuation, electronics for MEMS and industrial applications. The new edition has been considerably revised and updated to include newer technologies such as ultrafast laser machining, 3D printing for biomedical applications, wearable sensors, microanalytical systems, and more. Each expertly written article provides a concise overview of a particular aspect of microsystems, and is accompanied by extensive references, guiding the user to the most relevant further reading within the ever-expanding available literature.
More details
Edition
2nd edition
Language
English
Place of publication
United States
Target group
Professional and scholarly
Dimensions
Height: 276 mm
Width: 216 mm
Weight
1000 gr
ISBN-13
978-0-323-95478-5 (9780323954785)
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Schweitzer Classification
Other editions
Additional editions

Previous edition

Person
Yogesh B. Gianchandani is a Professor at the University of Michigan, Ann Arbor, in the Department of Electrical Engineering and Computer Science, with a courtesy appointment in the Mechanical Engineering Department. He also serves as the Director for the Engineering Research Center for Wireless Integrated Microsystems (WIMS). Dr. Gianchandani's research interests include the design, fabrication, and packaging of micromachined sensors and actuators. He is a fellow of IEEE and serves as an editor or board member of several journals.
Editor-in-chief
Content
Materials
Fabrication and Packaging
Electronics and Systems Design
Actuation Mechanism
Physical Sensing
Chemical and Biological Systems
Optical Systems
Industrial Applications
Emerging Topics
Fabrication and Packaging
Electronics and Systems Design
Actuation Mechanism
Physical Sensing
Chemical and Biological Systems
Optical Systems
Industrial Applications
Emerging Topics