Advances in Thermal Modelling of Electronic Components and Systems
Published on 1. July 1988
Book
Hardback
476 pages
978-0-89116-689-4 (ISBN)
More details
Language
English
Place of publication
Washington
United States
Target group
College/higher education
Illustrations
d.ch.
Dimensions
Height: 241 mm
Width: 165 mm
Weight
900 gr
ISBN-13
978-0-89116-689-4 (9780891166894)
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Schweitzer Classification