
Memory, Microprocessor, and ASIC
Wai-Kai Chen(Editor)
CRC Press
1st Edition
Published on 26. March 2003
Book
Hardback
384 pages
978-0-8493-1737-8 (ISBN)
Description
Timing, memory, power dissipation, testing, and testability are all crucial elements of VLSI circuit design. In this volume culled from the popular VLSI Handbook, experts from around the world provide in-depth discussions on these and related topics. Stacked gate, embedded, and flash memory all receive detailed treatment, including their power consumption and recent developments in low-power memories. Reflecting the rapid development and importance of systems-on-a-chip (SOCs), an entire chapter is devoted to application-specific integrated circuits (ASICs). Design-related topics include microprocessor architectures, layout methods, design verification, testability concepts, and various CAD tools.
.
.
More details
Series
Language
English
Place of publication
Bosa Roca
United States
Publishing group
Taylor & Francis Inc
Target group
Professional and scholarly
Professional
Illustrations
277 s/w Abbildungen, 33 s/w Tabellen
33 Tables, black and white; 277 Illustrations, black and white
Dimensions
Height: 260 mm
Width: 183 mm
Thickness: 25 mm
Weight
915 gr
ISBN-13
978-0-8493-1737-8 (9780849317378)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions


Wai-Kai Chen
Memory, Microprocessor, and ASIC
E-Book
03/2003
1st Edition
CRC Press
€244.99
Available for download
Person
Wai-Kai Chen
Content
System Timing. ROM/PROM/EPROM. SRAM. Embedded Memory. Flash Memories. Dynamic Random Access Memory. Low-Power Memory Circuits. Timing and Signal Integrity Analysis. Microprocessor Design Verification. Microprocessor Layout Method. Architecture. ASIC Design. Logic Synthesis for Field Programmable Gate Array (EPGA) Technology. Testability Concepts and DFT. ATPG and BIST. CAD Tools for BIST/DFT and Delay Faults.