Cover: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - CRC Press

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

1st Edition
Published on 30. December 2021
Book
Hardback
290 pages
978-1-032-16081-8 (ISBN)
€171.40incl. 7% vat
Shipment within 10-20 days

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