
Advances in Computational Intelligence. MICAI 2023 International Workshops
WILE 2023, HIS 2023, and CIAPP 2023, Yucatán, Mexico, November 13-18, 2023, Proceedings
Springer (Publisher)
Published on 20. January 2024
Book
Paperback/Softback
XXIV, 454 pages
978-3-031-51939-0 (ISBN)
Description
This conference LNAI 14502 volume constitutes the workshop proceedings of 22nd Mexican International Conference on Artificial Intelligence, held in November 2023 in Mérida, Yucatán, México. The total of 34 papers presented in this volume was carefully reviewed and selected from 54 submissions.
The proceedings of MICAI 2023 workshops are structured into three sections:
- WILE 2023: 16th Workshop on Intelligent Learning Environments- HIS 2023: 16th Workshop of Hybrid Intelligent Systems
- CIAPP 2023: 5th Workshop on New Trends in Computational Intelligence and Applications
More details
Series
Edition
2024 ed.
Language
English
Place of publication
Cham
Switzerland
Publishing group
Springer International Publishing
Target group
Professional and scholarly
Illustrations
69 s/w Abbildungen, 232 farbige Abbildungen
XXIV, 454 p. 301 illus., 232 illus. in color.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 27 mm
Weight
727 gr
ISBN-13
978-3-031-51939-0 (9783031519390)
DOI
10.1007/978-3-031-51940-6
Schweitzer Classification
Other editions
Additional editions

Hiram Calvo | Lourdes Martínez-Villaseñor | Hiram Ponce
Advances in Computational Intelligence. MICAI 2023 International Workshops
WILE 2023, HIS 2023, and CIAPP 2023, Yucatán, Mexico, November 13-18, 2023, Proceedings
E-Book
01/2024
Springer
€85.59
Available for download
Content
Artificial intelligence. - Knowledge representation and reasoning.- Planning and scheduling.- Control methods.- Philosophical/theoretical foundations of artificial intelligence.- Computer vision.- Machine learning.- Symbolic and algebraic manipulation.- Simulation theory.- Robots.- Evolutionary computation.- Intelligent systems.- Natural language processing.- Bioinformatics.- Medical applications using AI.