MAP and TOP
Advanced Manufacturing Communications
Published on 15. April 2012
Book
Paperback/Softback
XIV, 194 pages
978-1-4684-7652-1 (ISBN)
Description
Advances in technology are making the business and manufacturing environment increasingly complex. Standards can help us cope with this complexity. Given the strategic importance of computers in the economies of the industrial world, it is fitting that one of the most significant commercial stories of our time is the standardization of computer communications. Quite frankly, when we joined with other computer users to launch this effort we didn't predict its scope and we should have done. public visibility. In restrospect, I guess The computer assisted technologies looming on the horizon offer some of the greatest functional and productivity tools available to improve business operations. However, the absence of a standardized electronic link permeating most business organizations poses a severe impediment to the efficient deployment of this technology. The feasibility of using computer controlled devices to design, test, and manufacture products - as part of a massive network - is well within our technological grasp. However, unless the world agrees upon a global set of standards that will make multi-vendor computer systems interoperable, successful implementation of these technologies becomes less and less attractive.
More details
Edition
Softcover reprint of the original 1st ed. 1987
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
XIV, 194 p.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 12 mm
Weight
324 gr
ISBN-13
978-1-4684-7652-1 (9781468476521)
DOI
10.1007/978-1-4684-7650-7
Other editions
Additional editions
Book
11/1987
Kluwer Academic Publishers
€89.13
Article exhausted; check different version
Content
1 Introduction.- 2 Current Manufacturing Techniques.- 3 The Network - The Physical Transmission Medium.- 3.1 Basic communications.- 3.2 Communications options.- 3.3 Distributed LANs.- 3.4 Head ends.- 4 The Seven Layer Model.- 4.1 The application itself.- 4.2 Applications layer (layer 7).- 4.3 Presentation layer (layer 6).- 4.4 Session layer (layer 5).- 4.5 Transport layer (layer 4).- 4.6 Network layer (layer 3).- 4.7 Datalink layer (layer 2).- 4.8 Physical layer (layer 1).- 4.9 Interconnecting MAP and TOP with each other and with other systems.- 4.10 Technical and Office Protocols (TOP).- 5 The Standards Scene.- 5.1 The origins of OSI.- 5.2 The International Standards Organization (ISO).- 5.3 ISO stages of development of standards.- 5.4 National activity in the UK.- 5.5 Who's who in standards.- 6 Key Issues.- 6.1 The functionality of MMS.- 6.2 Interoperability.- 6.3 Testing.- 7 Map and Top Application Case Studies.- 7.1 The Towers of Hanoi and beyond.- 7.2 Cell controller applications.- 7.3 A link from design to assembly and inspection.- 7.4 MAP in the electronics test environment.- 7.5 AIMS - an Assembly Information Management System applied to engine assembly.- 7.6 Using MAP in the factory.- 7.7 MAP in printed circuit board assembly.- 7.8 Communications in the aerospace industry.- 7.9 MAP in General Motors.- 8 The Way Ahead.- 8.1 The future.- 8.2 MAP and TOP products.- Useful Addresses.- Abbreviations.- Sources and Recommendations for Further Reading.