
Diffusion and Stresses
Trans Tech Publications Ltd (Publisher)
Published on 29. April 2007
Book
Paperback/Softback
186 pages
978-3-908451-41-9 (ISBN)
Article exhausted; check different version
Description
The question of the interrelationship between diffusion and stress is almost as old as the investigation of diffusion itself. Nowadays, the study of various diffusion and solid-state reaction processes in thin films and multilayers is a vital area of research activity in which, inevitably, diffusion-induced or thermal stresses are of primary importance.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The question of the interrelationship between diffusion and stress is almost as old as the investigation of diffusion itself. Nowadays, the study of various diffusion and solid-state reaction processes in thin films and multilayers is a vital area of research activity in which, inevitably, diffusion-induced or thermal stresses are of primary importance.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
More details
Series
Language
English
Place of publication
Zurich
Switzerland
Target group
Professional and scholarly
College/higher education
Dimensions
Height: 240 mm
Width: 170 mm
Thickness: 9 mm
Weight
400 gr
ISBN-13
978-3-908451-41-9 (9783908451419)
DOI
10.4028/www.scientific.net/DDF.264
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
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Dezso L. Beke | Z. Erd?lyi | I.A. Szab?
Diffusion and Stresses
Software
04/2007
Trans Tech Publications Ltd
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Dezso L. Beke | Z. Erdelyi | I.A. Szabo
Diffusion and Stresses
E-Book
04/2007
Trans Tech Publications Ltd
€171.20
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Content
<ul><li>Stress and Intermixing in Epitaxial Ni(111)/Mo(110) Superlattices</li><li>Redistribution of Implanted Species in Polycrystalline Silicon Films on Silicon Substrate </li><li>Investigating Interdiffusion in Mo/V Multilayers from X-Ray Scattering and Kinetic Simulations </li><li>Intermixing in Cu/Co: Molecular Dynamics Simulations and Auger Electron Spectroscopy Depth Profiling </li><li>Simultaneous Measurement of Tracer Jump Frequencies on Different Sublattices in Ga<sub>7</sub>Pd<sub>3</sub> Using PAC </li><li>Dopant Diffusion during Amorphous Silicon Crystallization</li><li> Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System </li><li>The Stress Field in Cu-Fe-Ni Diffusion Couples</li><li>Effect of Morphology on the Mobility of Nanosized Liquid Pb Inclusions in Solid Al </li><li>Nonlinear Field Theory of the Stress Induced Interdiffusion and Mass Transport </li><li>Stress Evolution in Thin Films; Diffusion and Reactions</li><li>Cross Diffusion-Stresses Effects</li><li>Nanoscale Effects in Interdiffusion</li><li>Diffusion-Induced Stresses: Theory and Applications</li><li>Nonequilibrium Vacancies in Nanosystems </li><li>Nonlinear Stress Effects in Diffusion</li><li>Stress Relaxation Mechanisms during Cd<sub>21</sub>Ni<sub>5</sub> Intermetallic Growth under High Hydrostatic Pressure </li><li>Thermal and Mechanical Stability of Polycrystalline Nanowires</li><li>On the Role of Stress, Strain and Diffusion in Dissolution - Condensation Mechanism of Liquid Metal Embrittlement </li><li>Diffusion of Implanted Metals in Tantalum Silicide</li><li>Solid-State Reactions in Ni(10 nm)/C(2 nm)/Si(001) Thin Film System </li><li>Influence of Annealing Environment and Film Thickness on the Phase Formation in the Ti/Si(100) and (Ti +Si)/Si(100) Thin Film Systems </li><li>Study of Diffusion and Reaction Diffusion in the Fe-C-Nb System</li><li>On the Local Equilibrium during Dissolution of a Thin Film</li></ul>