
Sensors Update
Wiley-VCH (Publisher)
1st Edition
Published on 21. January 2003
Book
Hardback
X, 314 pages
978-3-527-30601-5 (ISBN)
from
€209.00
Article is exhausted; no reprint
Description
Sensors Update ensures that you stay at the cutting edge of the field. Built upon the series Sensors, it presents an overview of highlights in the field. Coverage includes current developments in materials, design, production, and applications of sensors, signal detection and processing, as well as new sensing principles.
With this unique combination of information in each volume, Sensors Update will be of value for scientists and engineers in industry and at universities, to sensors developers, distributors, and users.
All volumes of Sensors Update are online available at WileyInterScience
With this unique combination of information in each volume, Sensors Update will be of value for scientists and engineers in industry and at universities, to sensors developers, distributors, and users.
All volumes of Sensors Update are online available at WileyInterScience
All prices
More details
Series
Edition
1., Aufl.
Language
English
Place of publication
Weinheim
Germany
Target group
Professional and scholarly
Sensorindustrie, Halbleiterindustrie, Hersteller von Sensoren, Automatisierungsindustrie, Hersteller von Messgeräten
Illustrations
158
19 s/w Tabellen, 158 s/w Abbildungen
Illustrations, maps
Dimensions
Height: 24 cm
Width: 17 cm
Weight
764 gr
ISBN-13
978-3-527-30601-5 (9783527306015)
Schweitzer Classification
Content
List of Contributors.PART 1. SENSOR TECHNOLOGY.1.1 Review: Automatic Model Reduction for Transient Simulation of MEMS-based Devices (E. B. Rudnyi and J. G. Korvink).1.2 Nanotube Membrane Sensors: Resistive Sensing and Ion Channel Mimetics (M. Wirtz and C. R. Martin).1.3 Signal Processing Architectures for Chemical Sensing Microsystems (D. M. Wilson and T. Roppel).1.4 CMOS Single Chip Gas Detection Systems - Part I. (C. Hagleitner, et al.).PART 2. SENSOR APPLICATIONS.2.1 Earthquake Sensor (T. Yanada, et al.).2.2 Microelectronic Bonding Processes Monitored by Integrated Sensors (M. Mayer and J. Schwizer).2.3 Electronic Tongues and Combinations of Artificial Senses (F. Winquist, et al.).Index.