High Performance Flip Chip Process Technologies
Book
Hardback
500 pages
978-0-07-146895-4 (ISBN)
Description
This title helps you understand and utilize the latest flip chip technology. "High Performance Flip Chip Technologies" fully covers the new lowcost flip chip processes and material systems that make the manufacture of miniature consumer electronic devices possible.
More details
Language
English
Place of publication
London
United States
Publishing group
McGraw-Hill Education - Europe
Target group
Professional and scholarly
ISBN-13
978-0-07-146895-4 (9780071468954)
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Schweitzer Classification
Person
Daniel Baldwin, Ph.D. is an associate professor of mechanical engineering at the Georgia Institute of Technology where he heads the Low Cost Flip Chip Packaging Research Center.
Content
Part 1: Flip Chip TechnologyPart 2: Advances in Flip Chip Process TechnologyPart 3: Modeling and Analysis of Flip Chip Process TechnologyPart 4: Thermal Analysis, Stress Analysis and Reliability Prediction