Input/Output Interconnect Networks for Gigascale Systems
Published on 30. November 2008
Book
Hardback
550 pages
978-1-59693-246-3 (ISBN)
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Description
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.
More details
Edition
Unabridged edition
Language
English
Place of publication
Norwood
United States
Target group
Professional and scholarly
Edition type
Unabridged edition
ISBN-13
978-1-59693-246-3 (9781596932463)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Muhannad S. Bakir
Integrated Interconnect Technologies for 3D Nanoelectronic Systems
E-Book
01/2008
1st Edition
Artech House
€158.99
Available for download
Persons
Muhanned S. Bakir is a research engineer at the Microelectronics Research Center and adjunct professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology. James D. Meindl is the director of the Joseph M. Pettit Microelectronics Research Center and is the founding director of the Nanotechnology Research Center at Georgia Institute of Technology, where he is also the Joseph M. Pettit Chair Professor of Microsystems.
Content
Die-Package Interaction and Impact on Low-k ILD.; Mechanically Compliant I/O Interconnects and Packaging.; Power Delivery Design and Analysis.; Optical Interconnects and Various Approaches for Chip-to-Chip Signaling.; CMOS Integrated Optical Devices.; 3D Integration and Wafer Stacking Technology.; Through-Wafer Interconnects.; Integrated Micropumps and Fluidic Channels.; CNT Thermal Properties & Applications for Heat Removal.; Wafer-Level Testing and Probe Substrates.; The Convergence of Semiconductor Technology and the Life Sciences.