Body Channel Communication
1st Edition
Published on 1. January 2021
Book
Hardback
576 pages
978-1-4665-7141-9 (ISBN)
Description
This is the first book to comprehensively describe the emerging technology of Body Channel Communication. Body Channel Communication exploits the relatively high conductivity of the human body to transform it into a signal transmission channel for wireless signals. The book explains how the human body can be utilized as a communication medium for connecting devices for a variety of applications including the continuous monitoring of physiological signals to assist in prevention, diagnosis, and rehabilitation.
Key selling features:
Presents the fundamental concepts behind Body Channel Communication (BCC)
Provides examples of applications of BCC systems including health care monitoring, mobile phone, and music player applications
Provides the background knowledge needed to understand the physics of BCC using the electrical properties of the human body
Describes the use of high-speed communication with low-energy consumption compared to traditional radio-frequency methods including ZigBee, UWB, and RFID
Discusses the advantages of BCC technology over traditional radio frequency methods such as higher speed, lower energy consumption, and reduced inconvenience for the patient
Key selling features:
Presents the fundamental concepts behind Body Channel Communication (BCC)
Provides examples of applications of BCC systems including health care monitoring, mobile phone, and music player applications
Provides the background knowledge needed to understand the physics of BCC using the electrical properties of the human body
Describes the use of high-speed communication with low-energy consumption compared to traditional radio-frequency methods including ZigBee, UWB, and RFID
Discusses the advantages of BCC technology over traditional radio frequency methods such as higher speed, lower energy consumption, and reduced inconvenience for the patient
More details
Language
English
Place of publication
Bosa Roca
United States
Publishing group
Taylor & Francis Inc
Target group
Professional and scholarly
Professional Practice & Development
Illustrations
300 s/w Abbildungen
300 Illustrations, black and white
Dimensions
Height: 234 mm
Width: 156 mm
ISBN-13
978-1-4665-7141-9 (9781466571419)
Copyright in bibliographic data is held by Nielsen Book Services Limited or its licensors: all rights reserved.
Schweitzer Classification
Persons
Joonsung Bae (S'07) received the B.S. and M.S. degree in Department of Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2007 and 2009, respectively. He is currently working toward the Ph.D. degree in Department of Electrical Engineering at KAIST.
He has worked on developing a transceiver for high speed and low power on-chip global interconnects. He also engaged in developing low energy wireless CMOS transceivers for communicating among wearable and implantable devices. His current research interests include low energy transceiver design for wireless body area networks and body channel communications with channel analysis. He received the Asian Solid-State Circuits Conference (A-SSCC) Best Design Award in 2011.
Hoi-Jun Yoo (M'95 - SM'04 - F'08) graduated from the Electronic Department of Seoul National University, Seoul, Korea, in 1983 and received the M.S. and Ph.D. degrees in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, in 1985 and 1988, respectively. His Ph.D. work concerned the fabrication process for GaAs vertical optoelectronic integrated circuits.
From 1988 to 1990, he was with Bell Communications Research, Red Bank, NJ, where he invented the two-dimensional phase-locked VCSEL array, the front-surface-emitting laser, and the high-speed lateral HBT. In 1991, he became a manager of the DRAM design group at Hyundai Electronics and designed a family of fast-1M DRAMs to 256M synchronous DRAMs. In 1998, he joined the faculty of the Department of Electrical Engineering at KAIST and now is a full professor. From 2001 to 2005, he was the director of System Integration and IP Authoring Research Center (SIPAC), funded by Korean Government to promote worldwide IP authoring and its SOC application. From 2003 to 2005, he was the full time Advisor to Minister of Korea Ministry of Information and Communication and National Project Manager for SoC and Computer. In 2007, he founded System Design Innovation & Application Research Center (SDIA) at KAIST to research and to develop SoCs for intelligent robots, wearable computers and bio systems. His current interests are high-speed and low-power Network on Chips, 3D graphics, Body Area Networks, biomedical devices and circuits, and memory circuits and systems. He is the author of the books DRAM Design (Seoul, Korea: Hongleung, 1996; in Korean), High Performance DRAM (Seoul, Korea: Sigma, 1999; in Korean), Low-Power NoC for High-Performance SoC Design (CRC Press, 2008), Mobile 3D Graphics SoC from Algorithm to Chip (Wiley-IEEE Presss, 2010), Bio-Medical CMOS ICs (Springer, 2010), and chapters of Networks on Chips (New York, Morgan Kaufmann, 2006), Circuits at the Nanoscale (CRC Press, 2009), and Embedded Memories for Nano-Scale VLSIs (Springer, 2009).
He has worked on developing a transceiver for high speed and low power on-chip global interconnects. He also engaged in developing low energy wireless CMOS transceivers for communicating among wearable and implantable devices. His current research interests include low energy transceiver design for wireless body area networks and body channel communications with channel analysis. He received the Asian Solid-State Circuits Conference (A-SSCC) Best Design Award in 2011.
Hoi-Jun Yoo (M'95 - SM'04 - F'08) graduated from the Electronic Department of Seoul National University, Seoul, Korea, in 1983 and received the M.S. and Ph.D. degrees in Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, in 1985 and 1988, respectively. His Ph.D. work concerned the fabrication process for GaAs vertical optoelectronic integrated circuits.
From 1988 to 1990, he was with Bell Communications Research, Red Bank, NJ, where he invented the two-dimensional phase-locked VCSEL array, the front-surface-emitting laser, and the high-speed lateral HBT. In 1991, he became a manager of the DRAM design group at Hyundai Electronics and designed a family of fast-1M DRAMs to 256M synchronous DRAMs. In 1998, he joined the faculty of the Department of Electrical Engineering at KAIST and now is a full professor. From 2001 to 2005, he was the director of System Integration and IP Authoring Research Center (SIPAC), funded by Korean Government to promote worldwide IP authoring and its SOC application. From 2003 to 2005, he was the full time Advisor to Minister of Korea Ministry of Information and Communication and National Project Manager for SoC and Computer. In 2007, he founded System Design Innovation & Application Research Center (SDIA) at KAIST to research and to develop SoCs for intelligent robots, wearable computers and bio systems. His current interests are high-speed and low-power Network on Chips, 3D graphics, Body Area Networks, biomedical devices and circuits, and memory circuits and systems. He is the author of the books DRAM Design (Seoul, Korea: Hongleung, 1996; in Korean), High Performance DRAM (Seoul, Korea: Sigma, 1999; in Korean), Low-Power NoC for High-Performance SoC Design (CRC Press, 2008), Mobile 3D Graphics SoC from Algorithm to Chip (Wiley-IEEE Presss, 2010), Bio-Medical CMOS ICs (Springer, 2010), and chapters of Networks on Chips (New York, Morgan Kaufmann, 2006), Circuits at the Nanoscale (CRC Press, 2009), and Embedded Memories for Nano-Scale VLSIs (Springer, 2009).
Content
Introduction. Electrical Properties of Human Body and Electrode. Channel Characteristics. Channel Modeling Via Equivalent Circuit Approach. Channel Modeling Via Electromagnetic Wave Approach. Channel Modeling Via Maxwell's Equations Analysis. Basic Concepts in BCC Transceiver Design. Body-Coupled Digital Data PHY Transceiver. BCC/MICS Dual-Band Transceiver for Wearable/Implantable Sensor Networks. Scalable Double-FSK Transceiver for Wireless Body Area Networks. Examples of BCC Systems.