
Materials Science of Microelectromechanical Systems (MEMS) Devices IV: Volume 687
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
334 pages
978-1-107-41212-5 (ISBN)
Description
Microelectromechanical systems (MEMS) has been able to successfully acceded to several markets, including pressure sensors, gyroscopes, accelerometers, fluidics and data storage, representing a total revenue of some $2 billion in 2000. However, MEMS has the potential to offer reliable and cost-effective solutions to many other fields. The current expectation is that we will witness the appearance of diverse MEMS structures for power generation, propulsion, biomedical applications, optical switching, infrared sensing, microphones and displays, to name just a few. This plethora of activity is possible due to the increased understanding of the properties of the micromanufacturing materials involved, the availability of processing equipment with enhanced capabilities, and the effort of a large number of researchers and scientists. This book, first published in 2002, focuses on the materials science of MEMS structures and the films involved to create those structures. Topics include: applications metrology; mechanical properties; microstructure and processing; applications; processing techniques; alternative materials; and surface engineering issues in MEMS structures and devices.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 18 mm
Weight
450 gr
ISBN-13
978-1-107-41212-5 (9781107412125)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Persons
Editor
Case Western Reserve University, Ohio
Massachusetts Institute of Technology
Content
Preface; Materials Research Society symposium proceedings; Part I. Applications Metrology; Part II. Mechanical Properties I; Part III. Microstructure and Processing I; Part IV. Applications; Part V. Poster Session; Part VI. Processing Techniques; Part VII. Alternative Materials; Part VIII. Microstructure and Processing II; Part IX. Mechanical Properties II; Part X. Surface Engineering Issues in Mems Structures and Devices; Author index; Subject index.