Cover: New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Springer

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

Springer (Publisher)
Published on 16. February 2016
Book
Paperback/Softback
VIII, 72 pages
978-3-031-00899-3 (ISBN)
€29.95incl. 7% vat
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