Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Will be published approx. on 30. May 2022
Book
Paperback/Softback
648 pages
978-0-7918-8550-5 (ISBN)
Description
The proceedings of InterPACK2021 explore the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.