CMOS Analog and Mixed-Signal Circuit Design

Practices and Innovations
CRC Press
  • 1. Auflage
  • |
  • erschienen am 3. Juni 2020
  • Buch
  • |
  • Hardcover
  • |
  • XVI, 270 Seiten
978-0-367-43010-8 (ISBN)
The purpose of this book is to provide a complete working knowledge of the Complementary Metal-Oxide Semiconductor (CMOS) analog and mixed-signal circuit design, which can be applied for System on Chip (SOC) or Application-Specific Standard Product (ASSP) development. It begins with an introduction to the CMOS analog and mixed-signal circuit design with further coverage of basic devices, such as the Metal-Oxide Semiconductor Field-Effect Transistor (MOSFET) with both long- and short-channel operations, photo devices, fitting ratio, etc. Seven chapters focus on the CMOS analog and mixed-signal circuit design of amplifiers, low power amplifiers, voltage regulator-reference, data converters, dynamic analog circuits, color and image sensors, and peripheral (oscillators and Input/Output [I/O]) circuits, and Integrated Circuit (IC) layout and packaging.

Provides practical knowledge of CMOS analog and mixed-signal circuit design
Includes recent research in CMOS color and image sensor technology
Discusses sub-blocks of typical analog and mixed-signal IC products
Illustrates several design examples of analog circuits together with layout
Describes integrating based CMOS color circuit
  • Englisch
  • London
  • |
  • Großbritannien
Taylor & Francis Ltd
  • Für höhere Schule und Studium
  • 363
  • |
  • 17 s/w Tabellen, 363 s/w Abbildungen
  • |
  • 363 b/w images and 17 tables
  • Höhe: 235 mm
  • |
  • Breite: 156 mm
  • 689 gr
978-0-367-43010-8 (9780367430108)
weitere Ausgaben werden ermittelt
Arjuna Marzuki received the B.Eng (Hons) in Electronic (Communication) from the Department of Electronic & Electrical Engineering of the University of Sheffield in United Kingdom, MSc from Universiti Sains Malaysia and PhD from Universiti Malaysia Perlis. Arjuna joined Hewlett-Packard as R&D engineer in Wireless Semiconductor Division in 1997. His main jobs were to design radio frequency (RF) and radio frequency integrated circuit (RFIC) products. Such products were high frequency transistors, RF gain blocks, I/Q demodulator and etc. He then later joined IC Microsystems Sdn. Bhd. in Cyberjaya, Selangor, Malaysia as IC design staff engineer. In the company he involved in designing 12/10/8 bits digital-to-analog converter ICs and family of RFIC devices. He also managed to secure MYR 3.5 millions MGS fund for RFIC device research and development/commercialization. He later joined Agilent Technologies as IC design engineer/manager in Optical Product Division. His main jobs was to lead the analog design group which were assigned to design operational amplifiers, band-gap circuits, data-converters, I/Os, Power on reset and etc. A small contribution by the group was "Industry's 1st Digital Color Sensor IC with I/O via 2-wire Serial Interface", which was released in February 2006 by Avago Technologies. He has been granted 1 US patent and has developed more than 20 commercial products during his employment with Hewlett-Packard/Agilent Technologies and IC Microsystems. Arjuna has gained professional qualification as professional and chartered engineer when he was registered with Board of Engineers Malaysia and Engineering Council UK respectively. He is also a fellow of the Institute of Engineering and Technology (IET)- FIET. He was a recipient of 2010 IETE J C Bose Memorial Award. Arjuna is currently an associate professor at Universiti Sains Malaysia and engaged in teaching of analog integrated circuit courses at undergraduate and postgraduate level. He is also active in supervising PhD students in the area of microelectronic research. He has served as referees for many journals and conferences. He has so far published more than 60 technical papers in journals and conferences.
1. CMOS Analog and Mixed-Signal Circuit Design: An Overview1.1 Introduction
1.2 Notation, Symbology, and Terminology
1.3 Technology, Circuit topology, and methodology
1.4 Analog and Mixed-Signal Integrated Design Concepts
1.5. Summary
2. Devices: An Overview2.1 Introduction
2.2 The pn junction
2.3 Photo-devices
2.4 FETs
2.5 Process Fitting Ratio Concept
2.6 MOSFET Parameter Exercise
2.7 Spice Example
2.8 Summary

3. Amplifiers3.1 Introduction
3.2 Input Voltage Range
3.3 Signal Path of CMOS Operational Amplifier
3.4 CMOS Amplifier Parameters
3.5 Common Mode Feedback
3.6 Compensation in Amplifier
3.7 Wideband Amplifier techniques
3.8 Noises in Amplifiers [2]
3.9 Current Density Design Approach
3.10 Layout Examples
3.11 Summary

4. Low Power Amplifiers4.1 Introduction
4.2 Low voltage CMOS Amplifier
4.3 Subthreshold CMOS Amplifier
4.4 Current Reuse CMOS Amplifier
4.5 Other techniques
4.6 Spice Example
4.7 Summary

5. Voltage Regulator, References and Biasing5.1 Introduction
5.2 Current Sources
5.3 Self-Biased
5.4 CTAT and PTAT
5.5 Bandgap Voltage Reference
5.6 Diode-less Voltage Reference
5.7 Cascode Current source
5.8 Regulated Power Supply
5.9 Design example
5.10 Spice examples
5.11 Layout examples
5.12 Summary

6. Introduction of Advanced Analog Circuits6.1 Introduction
6.2 The MOSFET switch
6.3 Basic Switched Capacitor
6.4 Active Integrator
6.5 Sample and Hold Amplifier
6.6 Programmable Gain Amplifier
6.7. Chopper Amplifier
6.8 Dynamic Element matching technique in Circuits
6.9 Resistor-less Voltage reference
6.10 Switch-mode converter
6.11 Spice example
6.12 Layout Issue
6.13 Summary

7. Data converter7.1 Introduction
7.2 Digital-to-Analog Converter
7.3 Analog-to-Digital Converter
7.4 Spice example
7.5 Layout examples
7.6 Summary

8. CMOS Color and Image Sensor Circuit Design8.1 Introduction
8.2 Technology and Methodology
8.3 CMOS Color Sensor
8.4 CMOS Image Sensor
8.5 Layout example
8.6 Summary

9. Peripheral Circuits9.1 Introduction
9.2 Oscillator
9.3 Non overlapping Generator
9.3 Interface Circuitry
9.4 I/O Pad
9.5 Schmitt Trigger Circuit
9.6 Voltage Level Shifters
9.7 Power on Reset
9.8 ESD Circuit
9.9 Spice example
9.10 Layout examples
9.11 Summary
References10. Layout and Packaging10.1 Introduction
10.2. Process
10.3 Floorplanning
10.4 ESD and I/O Pad Layout
10.5 Analog Circuit Layout technique
10.6 Digital Circuit Layout technique
10.7 Packaging
10.8 Summary

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