VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things

25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers
 
 
Springer (Verlag)
  • 1. Auflage
  • |
  • erschienen am 17. Mai 2019
 
  • Buch
  • |
  • Hardcover
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  • 272 Seiten
978-3-030-15662-6 (ISBN)
 
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
1st ed. 2019
  • Englisch
  • Cham
  • |
  • Schweiz
Springer International Publishing
  • Für Beruf und Forschung
  • 36 s/w Abbildungen, 145 farbige Abbildungen
  • |
  • 145 Illustrations, color; 36 Illustrations, black and white; XIV, 257 p. 181 illus., 145 illus. in color.
  • Höhe: 241 mm
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  • Breite: 160 mm
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  • Dicke: 20 mm
  • 576 gr
978-3-030-15662-6 (9783030156626)
10.1007/978-3-030-15663-3
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