ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis

 
 
A S M International (Verlag)
  • erschienen am 30. November 2013
 
  • Buch
  • |
  • Softcover
  • |
  • 634 Seiten
978-1-62708-022-4 (ISBN)
 
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.Includes papers relating to the analysis of integrated circuits, MEMS, nanodevices, optoelectronics, discrete and passive components, electronic packaging, card level components, and electronic systems in the following areas:New and emerging analytical conceptsDiagnostic testing and debugPhysical fault isolation (optical, thermal, magnetic, etc.)Electrical characterisation and nanoprobingScanning probe technologyMicroscopy (SEM, TEM, light microscopy, etc.)Physical circuit-edit techniques (FIB, laser, etc.)Sample preparation (milling, polishing, etching, grinding, etc.)Chemical and materials analysis (Auger, SIMS, RBS, etc.)Metrology and in-line characterisation and analysisYield and reliability enhancementCompetitive analysisImage processingAnalytical thought processLaboratory and environmental safety and green processesAutomationLaboratory management and financeFuture challenges, especially those relating to the deep nanoscale regime
  • Englisch
  • Materials Park, OH
  • |
  • USA
  • Für Beruf und Forschung
  • Höhe: 229 mm
  • |
  • Breite: 152 mm
978-1-62708-022-4 (9781627080224)
1627080228 (1627080228)

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